Soder-Wick No Clean Desolder Braid 0.8mm-5ft (60-1-5) Overview
Soder-Wick No Clean Desolder Braid is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.
Soder-Wick No Clean Desolder Braid 0.8mm-5ft (60-1-5) Features & Benefits
Soder-Wick No Clean packaged in ESD-safe static dissipative bobbins
Minimizes the risk of damage associated with static electricity
Patented noncorrosive, halide free, organic no-clean flux
Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
Soder-Wick No Clean SD safely removes solder in all applications requiring Type ROL0 flux
BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
Soder-Wick No Clean Desolder Braid 0.8mm-5ft (60-1-5) Specifications
MIL-F-14256 F
NASA-STD-8739.3 Soldered Electrical Connections
DOD-STD-883E, Method 2022
ANSI/IPC J STD-004, Type ROL0
Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit
#1 white, 0.030"/0.8mm width, 5' / 1.5 m length on SD bobbin
Soder-Wick No Clean Desolder Braid Resources
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