Soder-Wick No Clean Desolder Braid, 0.8mm-10ft (60-1-10)

Soder-Wick No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.

All wick is sealed in nitrogen-purged packaged to avoid corrosion and loss of performance from moisture and oxygen.

Soder-Wick No Clean Desolder Braid, 0.8mm-10ft (60-1-10) Features & Benefits

• Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins

• Minimizes the risk of damage associated with static electricity

• Patented noncorrosive, halide free, organic no-clean flux

• Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner

• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance

Soder-Wick No Clean Desolder Braid, 0.8mm-10ft (60-1-10) Applications

• Soder-Wick® No Clean SD safely removes solder in all applications requiring Type ROL0 flux

• BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes

Soder-Wick No Clean Desolder Braid, 0.8mm-10ft (60-1-10) Specifications

• MIL-F-14256 F

• NASA-STD-8739.3 Soldered Electrical Connections

• DOD-STD-883E, Method 2022

• ANSI/IPC J STD-004, Type ROL0

• Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818

• Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit

• #1 white, 0.030"/0.8mm width, 10' / 3.0 m length on SD bobbin

Soder-Wick No Clean Desolder Braid, 0.8mm-10ft (60-1-10) Resources

Technical Data Sheet

Safety Data Sheet

Desoldering Braid Tips & Tricks