IMDES Dino Benchtop Vapour Phase 860 x 640 x 460mm Description
The DINO-CONDENS-IT PROFILER is intended to use for reflow soldering printed circuit boards on the smaller scale, i.e. for individual pieces, proto types and small series. It is specially designed to use it for developing purposes of prototyping VERY LARGE PCB’s using BGAs, LGA’s components and stacked arrays. Due the small foot print of the DINO-CONDENS-IT PROFILER, forced air cooling, single phase you will able to place unit fast on every place you want use it. After placing it is running quickly and ensures at the same time highest solder quality. For intensive use, appropriately frequent checks and maintenance are required, due to the low GALDEN capacity.
IMDES Dino Benchtop Vapour Phase 860 x 640 x 460mm Features
Table model Top loader
Adjustable temperature profiles in the pre-heating zone (CVPRS*)
Adjustable TAL Time Above Liquid
ATS Anti Tomb Stone modus
Micro USB for the transfer of solderprofile data to PC
Window to observe the soldering process
Suitable for BGA’s, Stacked Packages
Oxygen Free Soldering
Homogeneous temperature transmission on the complete Assembly
No over heating of components
*Creative Vapor Phase Reflow Software
IMDES Dino Benchtop Vapour Phase 860 x 640 x 460mm Specifications
|
Power Supply |
Single Phase 220-240 Volt / 50-60 Hz |
|
Power Connector |
Three Prong Power Connector |
|
Max. Heating Capacity |
2500 Watt (ca. 12 A) |
|
Dimensions |
840 x 640 x 460 mm (L x W x H) |
|
Max. solder product format |
580 x 460 x 20 mm (L x W x H) |
|
Standard Cycle Time |
15-25 minutes (including heating up & cooling down) |
|
Standard Reflow Time (TAL Time above Liquids) |
3 - 50 seconds (max 70 seconds) |
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Prcess temperature (depends on minimum type) |
150 °C up to 240 °C = 302 °F up to 464°F |
|
Weight |
12 kg |
|
Solder Profiles |
Adjustable temperature profiles in the pre-heating zone (CVPRS*) |
|
TAL Time Above Liquid |
Adjustable TAL Time Above Liquid |
|
ATS |
Anti Tomb Stone modus (ATS) |
|
Micro USB Interface |
for the transfer of solder profile data to PC |
|
Cooling |
Forced Air cooling down to 70°C = 158 °F |
|
Storage Temperature |
-1°C to +70°C 30,2°F to 158°F |
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Heat Transfer Medium |
GALDEN LS with the boiling temperature as needed (max. 240°C max 464°F) |
|
Medium basic filling quanity |
ca. 1648 ml (1.65L) 3 Kg GALDEN |
| Out of Stock Availability | Available with short lead time |
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