Techspray Silicone Free Heat Sink Compound, 4oz

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1978-DP

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TS1978DP

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Techspray Silicone Free Heat Sink Compound, 4oz Overview

Silicone-Free Heat Sink Compound draws heat away when applied to a component.
Also known as thermal grease, thermal paste thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material.

In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.

Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.

Techspray Silicone Free Heat Sink Compound, 4oz Features & Benefits

Thermal conductivity - 0.92 W/m-K
Functional temperature range -40°F to 392°F (-40°C to 200°C)
Non-ozone depleting
Avoid solder defects due to silicon contamination
Easy application
Will not separate
Will not harden and crack

Techspray Silicone Free Heat Sink Compound, 4oz Data Sheet

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