MG Chemicals Fast Cure Thermally Conductive Adhesive, 50ml

MG Chemicals Fast Cure Thermally Conductive Adhesive, 50ml Overview

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 3 hours.

This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems.

8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

MG Chemicals Fast Cure Thermally Conductive Adhesive, 50ml Applications & Usages

This product is designed to bond heat sinks, LED’s, and other heat generating components in electronic assemblies. It is suitable for the manufacturing, repair, and hobbyist sectors. Use it when a thixotropic adhesive paste with maximum thermal conductivity and an extremely fast cure time is required. For automatic dispensing applications, use the 8329TFF, which offers a lower viscosity at the cost of slightly lower thermal conductivity.

 MG Chemicals Fast Cure Thermally Conductive Adhesive, 50ml Features

• Thermal conductivity: 1.02 W/(m·K)

• 1:1 mix ratio

• Working life: 4 minutes

• Cure time: 3 hours at 25 °C or 15 minutes at 65 °C

• Flame retardant – meets UL 94V-0 standard

• Good adhesion to most electronic substrates

• Good tensile strength

• Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons

• Room temperature storage

• Shelf life greater than two years

 MG Chemicals Fast Cure Thermally Conductive Adhesive, 50ml Specifications

Catalog Number: 8329TCF-50ML

Size: 78g (1.52 oz)

Packaging: Dual Cartridge