First Ever Temperature Stable Solder Paste
In what is a true market breakthrough, Henkel has developed the first-ever temperature stable solder paste. Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste is stable at 26.5 °C for one year and at temperatures of up to 40 °C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.
No refrigeration
Removal of cold storage improves logistics efficiency and reduces shipping and warehousing costs. On the production line, no thaw period is required, allowing for immediate start-up.
Improved stability
The key benefit to Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste is its stability. It is stable at the most extreme temperatures for extended lengths of time, yet still offers unmatched batch-to-batch consistency.
Improved printing
Leading the industry in paste-transfer efficiency, Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste also delivers up to 24-hour abandon times, up to 72-hour stencil life and more than 95% on-line paste utilization.
Improved reflow
Not only does Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste deliver the shiniest Pb-free solder joints in the industry, it also provides superior coalescence and wetting on long soak profiles, significantly reducing solder-related defects.
Improved Printing |
Improved Stability |
Improved Reflow |
Improved Paste Management |
Six Sigma quality paste deposition with extended abandon times | On-line stencil stability: 3 days @ 80% RH | Excellent coalescence in air for 0201, 01005 and 0.3 mm pitch components | Exceptional on-line paste utilization |
Groundbreaking standards for stencil life | Paste stability: 12x over conventional | After 3 days @ 80% RH, zero dewetting on long soak, high-temperature reflow profile | Eliminates end-of-day paste scrapping |
High yield paste volumes with lowest aspect ratio: 20% lower than industry standard | Elevated temperature stability: 100x over conventional | Minimal hot slump @ 182°C, improving solder joint reliability | Eliminates refrigerated preproduction and warehouse storage |
Industry leader in paste-transfer efficiency | Improved shipping logistics management | Best-in-class cosmetic appearance for Pb-free solder joints | Eliminates cold pack dry ice and overnight shipping |
Exceptional cost savings from reducing the required amount of paste | New flux technology improves total pad solderability in air with reduced solder paste volumes |
Attributes |
Current Technology |
Loctite GC 10 |
Regulatory Compliance | Halide-/halogen-free | Zero halogens added |
Particle Size Distribution | Type 3, 4 | Type 3, 4, 4.5 (4A), 5 |
Storage | ||
Performance Stable at 26.5°C | 1 month | 1 year |
Performance Stable at 40°C | 1 day | 1 month |
Performance Stable a 50°C | 0 | 1 week |
Process | ||
Abandon TIme | Up to 4 hours | Up to 24 hours |
Stencil Life | Up to 8 hours | Up to 72 hours |
Soak Temperature (Reflow) | 150-180°C | 150-200°C |
On-line Paste Utilization | 75% | > 95% |
Start-up Time | 4-24 hours | 0 hours |