MG Chemicals SAC305 Lead Free No Clean Solder Paste, 25g

MG Chemicals SAC305 Lead Free No Clean Solder Paste, 25g

MG Chemicals Ra Rosin Flux Paste 50G

MG Chemicals RA Rosin Flux Paste, 50G

Loctite GC 10 Lead- Free SAC 305 T4 Solder Paste, 500g Jar

Loctite GC 10
SKU
MC851
Call for Pricing

The Solder Paste Game Changer

First Ever Temperature Stable Solder Paste

In what is a true market breakthrough, Henkel has developed the first-ever temperature stable solder paste. Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste is stable at 26.5 °C for one year and at temperatures of up to 40 °C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.

No refrigeration 

Removal of cold storage improves logistics efficiency and reduces shipping and warehousing costs. On the production line, no thaw period is required, allowing for immediate start-up.

Improved stability 

The key benefit to Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste is its stability. It is stable at the most extreme temperatures for extended lengths of time, yet still offers unmatched batch-to-batch consistency. 

Improved printing 

Leading the industry in paste-transfer efficiency, Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste also delivers up to  24-hour abandon times, up to 72-hour stencil life and more than 95% on-line paste utilization.

Improved reflow 

Not only does Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste deliver the shiniest Pb-free solder joints in the industry, it also provides superior coalescence and wetting on long soak profiles, significantly reducing solder-related defects.

Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste Benefits 

Improved Printing 

Improved Stability

Improved Reflow

Improved Paste Management

Six Sigma quality paste deposition with extended abandon times On-line stencil stability: 3 days @ 80% RH Excellent coalescence in air for 0201, 01005 and 0.3 mm pitch components Exceptional on-line paste utilization
Groundbreaking standards for stencil life Paste stability: 12x over conventional After 3 days @ 80% RH, zero dewetting on long soak, high-temperature reflow profile Eliminates end-of-day paste scrapping
High yield paste volumes with lowest aspect ratio: 20% lower than industry standard Elevated temperature stability: 100x over conventional Minimal hot slump @ 182°C, improving solder joint reliability Eliminates refrigerated preproduction and warehouse storage
Industry leader in paste-transfer efficiency Improved shipping logistics management Best-in-class cosmetic appearance for Pb-free solder joints Eliminates cold pack dry ice and overnight shipping
Exceptional cost savings from reducing the required amount of paste   New flux technology improves total pad solderability in air with reduced solder paste volumes  

 

Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste Attributes 

Attributes

Current Technology    

Loctite GC 10

Regulatory Compliance Halide-/halogen-free Zero halogens added
Particle Size Distribution Type 3, 4 Type 3, 4, 4.5 (4A), 5
Storage    
Performance Stable at 26.5°C 1 month 1 year
Performance Stable at 40°C 1 day 1 month
Performance Stable a 50°C 0 1 week
Process    
Abandon TIme Up to 4 hours Up to 24 hours
Stencil Life Up to 8 hours Up to 72 hours
Soak Temperature (Reflow) 150-180°C 150-200°C
On-line Paste Utilization 75% > 95%
Start-up Time 4-24 hours 0 hours
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Loctite GC 10 Lead-Free SAC 305 T4 Solder Paste Literature Downloads