Pace IR 3000 Infared Rework System

PACE IR 3000 Infrared BGA Rework System Overview

The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3000 does not require heat-focusing nozzles, saving you thousands in additional costs. Instead, it uses a unique aperture system to control and precisely apply the heat to protect adjacent components. Using a high quality, specially developed IR thermal sensor, the process is completely closed loop temperature controlled using non-contact measuring methods. Sodr-Cam Reflow Process Observation Camera allows you to watch the entire reflow process happen in real time.

PACE IR 3000 Infrared BGA Rework System Features

• Infrared Top-Side Heater with Aperture Control
• Extensive Nozzles not required
• Operator-Friendly control Software Suite
• Thermocouple Inputs
• Adjustable-Height Bottom-Side IR Preheater
• Active Cooling Fan

PACE IR 3000 Infrared BGA Rework System Specifications

• Heater (top side): Medium/Long Wave IR, 500W
• Preheater (bottom-side): Medium/Long Wave IR, 1000W 220 x 155mm (8.6" x 8.6"), with adjustable working height
• Max Component Size: 65 x 65mm (2.5" x 2.5")
• Max PCB Size: 305 x 305mm (12" x 12")
• Resolution on Optics Adjustment: 0.52mm (0.02") per rotation
• Positioning Accuracy (Z axis): ± 25 µmeters (0.001")
• Vacuum: 450mm Hg
• Power Requirements: 120 VAC, 60 Hz or 230 VAC, 50 Hz (2000 watts maximum)
• Optics: High resolution, Vision Overlay System with colour camera
• Video inputs: 2 Composite (B/C) and 1 "S" Video (For alignment optics)
• Temperature setting range: Top Heater: 100°to 400°C (212°to 750°F)
  Bottom Heater: 100°to 221°C (212°to 430°F)