Metcal Modular Rework System Advanced

Metcal Modular Rework System Advanced

The MRS-1100A Modular Rework System is an integrated convection rework system for the removal and placement of BGA/CSP and SMT components.The MRS-1100A is comprised of a hand held convection tool, preheater, adjustable tool holder, and free-standing board holder to create a manually assisted rework system.

A series of nozzles, targeting a variety of applications, and optional light magnifier round out the product offering for this system.With standard features such as programmability, a digital display, program storage of up to 50 profiles, this system is not only versatile, but also easy and efficient to work with.

A choice of board holders and accessories are available that make the system capable of handling multiple sizes of PCBs.The MRS-1100A allows you the choice of using either the embedded profiling capability that can be configured to operate at a fixed temperature, or a four zone programming option.

The unit also allows the temperature to be controlled either at the heat output (internal) or at the board (external). The “external” control function uses a thermocouple which can be placed on the board or a component.

Metcal Modular Rework System Advanced Features

• Digital display for repeatable temperature settings and profile control
• Automatic control of the preheater for simple operation
• Easy profile creation for operator repeatability
• Integrated vacuum pickup for easy component removal
• Hand held or tool holder mounted for operator comfort
• Manual mode for quick setup
• External thermocouple for process setup and verification
• Digital controlled airflow for repeatable results
• X, Y, Z and Theta controls for component alignment
• Adjustable PCB holder for easy change outs
• Automatic vacuum lift off at the end of the cycle
• Password lockout of programmed profiles

Metcal Modular Rework System Advanced Applications

The MRS-1000 is perfect for removal and placement of SMT Components. Specific examples of applications include:

• Simple removal and replacement of delicate SMT components.
• Quick, easy and cost effective removal of BGA & CSP that will later be placed with your dedicated Array Package Rework System, this increases the productivity of your rework area and reduces your technicians workload.
• Automaticity lifts the component at the end of the cycle preventing operators from prematurely lifting components and damaging expensive PCBs.