The Scorpion Advanced Package Rework System ensures both accurate component placement and custom tailored reflow profiles in one user friendly, single platform rework system. The Scorpion System redefines precision and addresses the technical demands presented by component manufacturers today.
The challenges of array package rework, and the inability to easily inspect placement accuracy, call for a solution that allows for simultaneous viewing of Printed Circuit Board pads and component balls for accurate placement.
The Scorpion Rework System fills this need with quick, accurate placement through the use of an all new vision system employing dual image overlay technology. This new vision system features LED lighting both top and bottom for shadow-free component visualization and component alignment. The HD camera is ready to go out of the box.
The two-head modular design allows the Scorpion Rework System to be tailored to the users specific rework needs and allows precision alignment of the smallest BGAs, QFNs and Micro SMDs with the highest accuracy. The open-ended board holder fits a wide variety of large, small and odd-shaped boards while allowing precise positioning over the patented dual subzone preheater.
The standard auto-profile mode ensures fast and easy profile creation with a minimum of setup time. By selecting your tempera- ture targets any operator can quickly and accurately create reflow profiles for a wide variety of boards, and then save them in memory for future use.
Source temperatures and time intervals can be modified “On-the-Fly", eliminating the need to wait for the current profile to terminate before modifications can be made. Precise solder joint temperatures are measured and displayed on a real time graphical display, thus providing the necessary data to accurately and easily establish the optimum reflow profile for each particular application within minutes.
The modular design of the Scorpion Rework System allows it to be configured to the users specific needs. The two-head system with precision placement package features placement accuracy to 0.0015" (.038mm). The standard single-head system provides placement accuracy to 0.004" (.1mm).
The Scorpion system accepts the full range of APR and QX series reflow nozzles. Flux transfer plates and solder paste plates are available to ensure repeatable process control during the replacement operation.
Features and Benefits:
Hardware Features:
Software Features:
Operation Features:
Product Comprises:
| Input Voltage: | 208-240VAC, 50/60Hz, 15A-13A, Single Phase |
| Power Consumption: | |
| System Total: | 2800W |
| Inner Zone: | 900W |
| Outer Zone: | 1800W |
| Reflow Head: | 550W |
| Temperature Control Type: | Closed-Loop Control (Thermocouple) |
| Maximum Source Temperature: | |
| Reflow Head: | 400°C (752°F) |
| Pre-Heater: | 350°C (662°F) |
| Top Nozzle Airflow: | |
| Top Airflow Control: | Preset to Low, Medium, & High Flow Rates |
| Supply: | Self-Contained DC Pump (No Air Supply Required) |
| Component Handling: | |
| Maximum Field of View: | 45mm x 45mm (1.77" x 1.77") |
| Minimum Size: | 0.51mm x 0.25mm (0.020" x 0.10") |
| Maximum Weight: | 55g (1.94 oz.) |
| PCB Handling Capability | |
| Maximum Size: | 343mm (13.5") in Y axis, open-ended in X axis |
| Maximum Thickness: | 6mm (0.25") |
| System Warranty: | One Year Parts & Labor, 90 Days for Heaters & Lamps |
| Agency Approvals: | TUV German Standards, CE |
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| Out of Stock Availability | Available with short lead time |
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