MG Chemicals Slow Cure Thermally Conductive Adhesive, 200ml

MG Chemicals Slow Cure Thermally Conductive Adhesive, 200ml

MG Chemicals Medium Cure Thermally Conductive Adhesive, Flowable, 50ml

MG Chemicals Medium Cure Thermally Conductive Adhesive, Flowable, 50ml

MG Chemicals Medium Cure Thermally Conductive Adhesive, Flowable, 25ml

8329TFM-25ML
SKU
MG8329TFM-25ML
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MG Chemicals Medium Cure Thermally Conductive Adhesive, Flowable, 25ml Overview

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, thixotropic, and bonds well to a wide variety of substrates.

This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems.

For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

MG Chemicals Medium Cure Thermally Conductive Adhesive, Flowable, 25ml Feature

  • Thermal conductivity of 1.1 W/(m·K)

  • 1:1 mix ratio

  • Working life: 45 minutes

  • Cure time: 24 hours at room temperature or 2.5 hours at 65 °C (149 °F)

  • Provides strong electrical insulation

  • High tensile

  • Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons

  • Shelf life: ≥3 years

  • RoHS 3 compliant

MG Chemicals Medium Cure Thermally Conductive Adhesive, Flowable, 25ml Specifications

Catalog Number: 8329TFM-25ML

Size: 25ml (0.84 fl oz)

Packaging: Dual Syringe

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