Soder-Wick Rosin Flux Desolder Braid 2mm-25ft (50-3-25)

Soder-Wick® offers the state of the art in desoldering technology. Soder-Wick® is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.

All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.

Soder-Wick Rosin Flux Desolder Braid 2mm-25ft (50-3-25) Features & Benefits

• Soder-Wick® Rosin 5' and 10' spools packaged in ESD-safe static dissipative bobbins

• Minimizes the risk of damage associated with static electricity

• Noncorrosive ultra high purity Type R rosin flux

• Minimizes the risk of heat damage to the board

• Will not leave ionic contamination on the boards

Soder-Wick Rosin Flux Desolder Braid 2mm-25ft (50-3-25) Applications

• Soder-Wick® Rosin safely removes solder in all applications requiring Type ROL0 rosin flux

• BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes

Soder-Wick Rosin Flux Desolder Braid 2mm-25ft (50-3-25) Specifications

• MIL-F-14256 F type R flux

• NASA-STD-8739.3 Soldered Electrical Connections

• DOD-STD-883E, Method 2022

• ANSI/IPC J STD-004, Type ROL0

• #3 green, 0.080"/2.0mm width, 25' / 7.5 m length on spool